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『TIOL111』

IO-Link device transceiver with integrated surge protection function 'TIOL111'

The TIOL111 family transceiver implements an IO-Link interface for industrial bidirectional point-to-point communication. When connected to an IO-Link master via a 3-wire interface, the master can initiate communication with remote nodes and exchange data, with the TIOL111 functioning as the physical layer for communication. It has a surge resistance of 1.2kV (500Ω) according to IEC 61000-4-5 and features built-in reverse polarity protection. The simple interface, which can be programmed via pins, allows for easy connection to the controller's circuit. Output current limits can be set using an external resistor. It is equipped with fault notification and internal protection functions against voltage drop, overcurrent, and overheating. 【Features】 ■ Power supply voltage: 7V to 36V ■ Output configurable as PNP, NPN, or IO-Link ■ Supports IEC 61131-9 COM1, COM2, COM3 data rates ■ Low residual voltage: 1.75V at 250mA ■ Current limit adjustable from 50mA to 350mA *For more details, please contact us.

  • Other semiconductors
  • LINK device

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Smooth IoT implementation solutions by German manufacturers! Technical documentation available.

We are releasing a method to quickly and reliably advance IoT implementation! Significantly reduce wiring labor and downtime, among other factors.

Our company offers products from Mur Electonics that enable the smooth implementation of IoT. We are currently presenting a "Technical Document" that clearly introduces various solutions to address IoT challenges such as "wiring, programming, and connectivity"! (You can view it from "Download") 【Featured Technologies】 ■ "Active Wiring Reduction System" Converts existing fieldbus into a local bus optimized for wiring reduction. Wiring work can be reduced by up to 95%. ■ "DIGA (Self-Diagnosis Gateway)" Visualizes diagnostic information of remote I/O without the need for programming. Significantly reduces machine downtime. ■ "IODD on Board" By incorporating IODD into the device information file of the IO-Link master, bulk configuration of multiple IO-Link devices can be achieved on the IO-Link master. <Exhibiting at the Industrial Open Network Exhibition 2017> We will showcase various solutions! Dates: August 24, 2017 (Tokyo, Ota Ward Industrial Plaza PiO) August 29, 2017 (Osaka, Grand Cube Osaka) Time: 10:00 AM - 6:00 PM

  • Wiring materials
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  • connector
  • LINK device

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